Major Milestones
Fruit of Much Toil: LTCC Substrate
Low-temperature co-fired ceramics (LTCC) is a type of ceramic material used for embedding electric conduction circuits or passive component circuits. When sintered onto a substrate and paired with active components such as chips, these components jointly form a micro-functional module. LTCC is highly valued for its compact size, efficient heat dissipation, and its ability to facilitate high-frequency and high-speed transmission. Consequently, LTCC finds widespread application in various devices including cell phones, Wi-Fi systems, Bluetooth devices, power amplifiers, and vehicle electronics.
For over 30 years, ITRI has been at the forefront of LTCC technology development. In 2000, ITRI collaborated with the Japanese company MKE to create the world’s smallest Bluetooth LTCC module at that time. Offering comprehensive wireless system functionalities along with advantages such as micro-miniaturized components and cost-effectiveness, this breakthrough technology was transferred to multiple LTCC manufacturers. Consequently, it significantly increased the local content rate of radio frequency key components, thereby successfully stimulating the growth of the LTCC industry.
Additionally, in 2009, ITRI utilized its LTCC technology to support Conquer Electronics, a heavyweight in consumer electronics fuse, in developing high-efficiency ceramic chip fuse components. This collaborative effort resulted in improved reliability and safety of electronic products.
To further harness LTCC’s capability in high-frequency transmission, in 2022, ITRI partnered with DuPont MCM, a leading LTCC manufacturer, and various component material companies. The objective was to introduce 5G high-frequency mmWave communication applications into LTCC-related products. This collaboration effectively lowered the barriers for manufacturers aiming to enter the 5G mmWave communication market and heralded a significant market for independent 5G O-RAN technology.